SMARC® Full Size Module
The SMARC module with Intel® Atom™ Processor E3800 Series System-on-Chip is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.
SMARC form factor module, the LEC-BT, is certified by Intel for Intel® Gateway Solutions for the Internet of Things (IoT) using Windriver and McAfee software integration. Paired with ADLINK?s device-to-cloud platform SEMA Cloud (Smart Embedded Management Agent) that enables remote monitoring control and management, the LEC-BT is an ideal building block for developing IoT devices with a secure interconnection to the cloud.
To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
The ADLINK LEC-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.s 7.
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
- Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
- HDMI and LVDS, onboard eMMC
- GbE, camera interface
- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
- Extreme Rugged™ operating temperature: -40°C to 85°C